• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    SUMMARY The invention relates to a device and a method for compensating for temperature expansion effects in solid materials, as well as a method for manufacturing said device. Temperature compensation is made by the device mechanically cooperating with the device which is to be temperature compensated. The temperature compensation element (10) is connected to a housing consists of an enclosed disc which, via an obliquely (13) (11) temperature expansion coefficient, differs from the lane device whose enclosed disc. Both positive and negative temperature compensations can be performed. The manufacturing method consists of the components being heated or cooled so that a press-fit fit is achieved when the parts are joined and the temperature of the components is controlled to the intended temperature compensation range. To be published with Fig. 2
    公开号:SE1050478A1
    申请号:SE1050478
    申请日:2010-05-17
    公开日:2011-11-18
    发明作者:Goeran Cewers
    申请人:Mindray Medical Sweden Ab；
    IPC主号:
    专利说明:

    Parts such as hardness, fatigue properties, strength, corrosion resistance, surface smoothness, transparency, color, electrical properties, melting point, price, etc.
    When different materials are combined, it is common for the constituent materials to be different. In most cases, this does not cause any problems if the design is made on temperature expansion coefficients. in such a way that these temperature expansions do not damage the construction or the function. This can be achieved by having sufficient tolerances that allow the temperature effects and that the construction has a structure and a choice of material that gives as little effect as possible where the temperature can have an effect on the function.
    However, there are temperature-critical constructions where temperature compensation elements are needed for a satisfactory function during temperature fluctuations.
    Examples of temperature-critical constructions can be devices for micropositioning, control of laser beams, focusing of microscopes; atom, optical and ultrasound, semiconductor manufacturing, micropositioning sensors, spectroscopy and optical benches.
    In micropositioning, it is common for the positioning to be controlled by an actuator in the form of a piezoelectric crystal. A piezoelectric crystal has a control range of about 0.1% of the thickness of the crystal, i.e. the equipment range is very small in relation to the thickness of the crystal. To achieve greater movement, constructions have been developed in the form of bimorph crystals that have two layers of piezo material with opposite working directions. By designing the joined layers as a beam, a bend is achieved in the same way as bimetal. The piezo beam, on the other hand, becomes temperature stable because it consists of materials with the same coefficient of temperature expansion everywhere.
    The disadvantage of piezo beams, however, is that the force is limited due to the fragility of the piezo ceramic. 10 15 20 25 30 35 Another way to achieve greater movement with piezo technology is to connect a number of piezo elements in series in the form of a stack.
    This can be integrated in a similar way as in the manufacture of ceramic multilayer capacitors. A piezo actuator with a length of several centimeters can be manufactured in this way. If a stack is anchored at one end, the other end will move relative to the vicinity of the other end. The environment to the other end is normally made of the same material that is anchored at the end of the piezo stack. In order to obtain a relative movement that is not affected by the ambient temperature, the piezo stack and the surrounding material must have the same coefficient of temperature expansion. However, this is difficult to achieve, as the piezo material often has a coefficient of expansion of only a few ppm, and in some materials even a negative coefficient. Surrounding materials must then have the same coefficient, which greatly limits the selection of possible materials. Only certain special alloys and ceramic materials remain as possible alternatives. These options are often unsuitable due to strength, manufacturing methods, corrosion properties, or high cost.
    Today's existing solutions are, for example, that a second piezo stack is a reference point for the first. This gives an additional cost and limitation of the mechanical design. Another way is to use special materials as a reference point, as mentioned above. Another way is to insert an element with significant temperature expansion in series with the piezo stack. The piezo stack in series with the compensation element can then be made to have the same temperature expansion as the surrounding material. and US 6,148,842.
    In US 7,5l4,847 an aluminum body is used which This principle is described in the patent US 7,5l4,847 compensation part. Since aluminum has a relatively low coefficient of temperature expansion compared to ordinary construction materials, a large body like this is needed, which leads to significantly larger dimensions and a reduced response time.
    US 6,148,842 uses a closed container filled with oil as a compensating body. This solution provides a more compact compensation body because there are oils with a high coefficient of temperature expansion. The disadvantage, however, is that the oil must be hermetically sealed to avoid leakage, which leads to high manufacturing costs.
    Memory metal compensation methods are also described, for example, in U.S. Patent 5,059,850.
    However, this is a solution that is burdened by hysteria problems, material choices and high costs.
    The object of the invention is to provide a temperature compensation with a body which has a significantly greater coefficient of temperature expansion than metals and ordinary construction materials. A device that provides this compensation should be easy to manufacture.
    Summary of the invention These objects are achieved by means of the device according to the appended independent claims, wherein particular embodiments are dealt with in the dependent claims.
    The present invention thus seeks in particular to counteract, improve or eliminate one or more of the above-identified shortcomings and disadvantages in conventional technology, individually or in any combination, and at least partially solves the above-mentioned problems by providing an equipment according to the appended claims.
    The invention can in a first aspect be described as a mechanical temperature compensation element intended to be used as a compensation element for temperature expansion.
    The element comprises a flat element with a first coefficient of temperature expansion; a housing having a second temperature expansion coefficient different from the first temperature expansion coefficient; an inclined linkage device opposite the planar element which mechanically connects the planar element and the housing; in the event of a temperature change, the planar element expands radially and the link device is moved radially, the radial expansion from the planar element being converted into an orthogonal movement relative to the planar element, which lifts or lowers the housing depending on the temperature compensating element temperature.
    This construction provides a mechanical device which can be used to mechanically compensate for changes due to temperature changes and which can be used for temperature-critical constructions such as for example micropositioning, control of laser beams, focusing of microscopes; atom, optical and ultrasound, semiconductor manufacturing, micropositioning sensors, spectroscopy and optical benches. Or to compensate for the temperature dependence of the stroke of a piezo element.
    The temperature compensation takes place in that the flat material has a temperature coefficient which is higher or lower than an overlying casing or a casing consisting of two opposite halves. When a temperature change occurs, the planar element expands radially, which leads to a lever-like movement linking to the casing and lifting or lowering the mechanical device performing the casing orthogonally relative to the planar element.
    The flat element and the casing can have different shapes in different embodiments. For example, they can be either circular, polygonal or elliptical.
    In an embodiment of the mechanical temperature compensation element, the link device comprises a washer with a rhomboid cross-section, radial slots and or, separate segments with a rhomboid cross-section. It is through this construction, of the device mechanically linked between the planar element and the housing, that the lever-like movement is formed by the temperature-dependent radial change of the planar element.
    In a further embodiment of the mechanical temperature compensation element, the planar element has a coefficient of temperature expansion which is higher than that of the housing.
    This gives a positive temperature compensation which gives a lifting effect when the temperature increases. An example of a material that can be used for the flat element here is zinc.
    In a further embodiment of the mechanical temperature compensation element, the flat element has a coefficient of temperature expansion which is lower than that of the housing.
    This gives a negative temperature compensation, which means that the mechanical temperature compensation element lowers as the temperature increases.
    In another embodiment of the mechanical temperature compensation element, it can be connected in series with a piezo element.
    In such a coupling, the mechanical temperature compensation element is used to compensate for temperature-dependent changes in the stroke of the piezo element. However, as previously mentioned, the invention can be used to compensate for temperature for other temperature-critical constructions.
    A second aspect of the invention comprises a method of mounting the mechanical temperature compensation element which comprises cooling the planar element before mounting.
    A third aspect of the invention comprises a method of mounting the mechanical temperature compensation element, which comprises heating the housing before mounting.
    These two aspects of the invention consist in that the components are heated or cooled so that a press fit is achieved when the parts are joined and that the temperature of the components is controlled to the intended temperature compensation range.
    A fourth aspect of the invention includes a method of mechanically temperature compensating a temperature critical structure, comprising a planar element, having a coefficient of temperature expansion different from the coefficient of temperature expansion of its cavity, upon temperature change expands and thereby presses one, between the planar element and the casing. mechanically linked construction that lifts or lowers the housing orthogonally relative to the planar element that cooperates with the temperature-critical construction.
    According to a further aspect of the invention there is provided a method of temperature compensation wherein a temperature compensating element is used as a compensating element for temperature expansion, wherein with temperature change a planar element expands radially and an inclined link device is moved radially the radial expansion radially converted from the planar element to the element, movement, which raises or lowers a housing surrounding the planar element depending on the temperature of the temperature compensation element. The advantages of this method are as for the equipment described above. That in a relatively simple and inexpensive way you can get an automatic mechanical temperature compensation of a temperature-critical construction, for example a piezo element. General description of the drawings These and other aspects, features and advantages which the invention at least partially possesses become clearer and specified by the following description of embodiments of the present invention, where reference is made to the accompanying figures, in which Figure 1 shows in a schematic view an embodiment according to a principle of the invention, in this example the device is at its lowest operating temperature; Figure 2 shows the same embodiment as Figure 1, but with the device in its highest operating temperature; Figure 3 shows an embodiment where a negative temperature compensation can be achieved in accordance with the invention; In this example, the device is at its highest operating temperature; Figure 4 shows a detailed view of Figure 2 where the principle of the loan device is shown; and Figures 5 and 6 show variants of the lane devices.
    Description of embodiments A device according to the invention is obtained by enclosing a disk 10 with a relatively high coefficient of temperature expansion in a housing 11,12. The housing 11, 10. According to the embodiment, the housing consists of two discs which 12 have two parts enclosing the disk, each of which has a recess. The discs are assembled so that the recesses receive the disk 10 inside the housing. The disk 10 is in tension with a borrowing device 13, which may be a tray with a rhomboid cross-sectional shape according to Fig. 1. The disk 10 has a high coefficient of temperature expansion in relation to the housing 11, 12.
    With a rise in temperature, the disc 10 expands more in the radial direction than in the axial direction as the disc has a larger diameter than thickness. Furthermore, the disk 10 expands more than the housing 11,12, whereupon the link device 13 exposes the housing 11,12 to a radial pressure. The link device 13 consists in the exemplary embodiment of two rings with a rhomboid cross-section and exposes the housing 11,12 to a radial pressure.
    The rhomboid cross-sectional shape of the link device 13 has a function of an inclined strut 100,101, as illustrated in Fig. 4 with the diagonal lines in the temperature expansion of the link device 13 of the link device 13 will then be converted into an axial cross-section. The radial motion caused by motion with a gain factor determined by the inclination of the lines 100,101, desired specifications and applications. i.e. The embodiment of the link device 13 according to Fig. 1 shows the device at the lowest operating temperature and in Fig. 2 at the highest operating temperature. At typical operating temperature, the parts 11,12 of the casing will be separated by a distance, preferably half of that illustrated in Figure 2. to have contact only with the counter 10 and the casing 11,12 in In this Link device 13, at the same time the corners opposite the diagonals 100,101 in Fig. 3. position as at the highest operating temperature, the whole device will be held together in a continuous unit of press fit caused by radial pressure against the link device 13 from the disk 10.
    In order for the device to be able to withstand large axial counter-forces, the radial surface of the disc 10 is surrounded by a thin ring 14 with a hard material. In this way, deformation of the shape of the disk 10 is avoided even if it consists of a material that is softer than the casing. By choosing zinc as the material in the counter 10 and stainless steel in the rest of the device, for example, an axial temperature expansion coefficient of 150 ppm / degree can be achieved. This is about 10 times more than most construction materials. By varying the angle of the rhomboid shape of the link device 13, the mechanical reinforcement and thus the axial temperature expansion coefficient can be determined as desired.
    When the link device 13 is subjected to radial forces, it will subject the disk 10 to a counter force. This will lead to a compression of the same with a practically reduced temperature expansion effect. To reduce this effect, the link device 13 can be provided with slots according to Figure 5, or to consist of loose segments according to Figure 6. Slots in the link device 13 can also consist of non-continuous radial grooves.
    By using a material with a large coefficient of temperature expansion in the housing 11, 12 and that other material in the device consists of material with a relatively low coefficient of temperature expansion according to Figure 3, an axial negative coefficient of temperature expansion can be achieved.
    The ring 24 which forms a hard surface against the housing 21,22 then has a slightly different location compared with figure 2.
    In the present exemplary embodiment, the constituent parts are circular, however, the geometry of the device is not limited to these shapes, but the circular shape can be changed with polygons, ellipses or the like.
    Figures 5 and 6 show different variants of the link devices. As shown in Fig. 5, a plurality of linking devices may be arranged in a continuous ring.
    Alternatively, as shown in Fig. 6, a plurality of individual elements may be arranged in a circumference around the counter 10.
    According to one embodiment, a method for manufacturing a device described above is now described. As previously mentioned, the entire device is held together in the form of a press fit. At temperatures lower than the operating temperature range of the counter 10, all the components can be joined together without difficulty.
    An advantageous mounting method is then to cool the disk 10 to a low temperature before mounting, e.g. in liquid nitrogen. After assembly, the structure is placed in axial press and may be temperature equalized until the device reaches its temperature working range, after which the press can be removed.
    When mounting a device with a negative coefficient of temperature expansion according to Figure 3, the housing 21,22 is heated instead, and then the construction is set in axial press and allowed to temperature equalize until the device reaches its temperature working range, after which the press can be removed.
    权利要求:
    Claims (1)
    [1]
    A mechanical temperature compensation element intended for use as a temperature expansion compensation element, comprising - a planar element (10) having a first temperature expansion coefficient; a housing (II) having a second coefficient of temperature expansion different from the coefficient of temperature expansion; a inclined link device (13) opposite the planar element which mechanically connects the planar element and the housing; in the event of a temperature change, the planar element (10) expands radially and the link device is moved radially, the radial expansion radiating from the planar element being converted into an orthogonal movement relative to the planar element, which lifts or lowers the housing depending on temperature compensation element temperature. . The temperature compensation element according to claim 1, wherein the housing consists of two opposite halves. . The temperature compensation element according to claim 1-2, wherein the planar element consists of a circular disk or wherein the planar element consists of a polygon. . The temperature compensation element according to claim 1-3, wherein the casing is circular, or where the casing is polygonal. The mechanical temperature compensation element according to claims 1-4, wherein the link device comprises a washer with a rhomboid cross-section. 10 15 20 25 30 35 10. 11. 12. 13 13. The mechanical temperature compensation element according to claims 1-5, wherein the link device comprises radial slots. . Mechanical temperature compensation element according to claims 1-6, with rhomboid cross section. where the device comprises separate segments Mechanical temperature compensation elements according to claims 1-7, coefficient of temperature expansion is higher than that of the housing. where the mechanical temperature compensation element of the planar element according to claims 1-7, coefficient of temperature expansion is lower than that of the housing. The mechanical temperature compensation element of the planar element according to claims 1-9, wherein the planar element consists of zinc. The mechanical temperature compensation element according to claims 1-10, the temperature compensation element is connected in series where the mechanical with a piezo element. A method of manufacturing a temperature compensating element according to claims 1-11 which comprises cooling or heating the planar (10) structure in axial press after assembly of the element before assembly, and setting the temperature equalizer to the device when its temperature working range, after which the press is removed. The method of claim 12 for mounting the mechanical temperature compensation element of claim 8, comprising cooling the planar element prior to assembly. A method according to claim 12 for mounting the mechanical temperature compensation element according to claim 9, comprising heating the casing before mounting. Method for mechanically temperature-compensating a temperature-critical construction, comprising that a flat element, with a coefficient of temperature expansion which is different from the coefficient of temperature expansion of its casing, expands in the event of a temperature change and thereby presses a mechanically linked structure which lifts or lowers between the planar element and the casing. the housing is orthogonal to the planar element which cooperates with the temperature-critical construction. Method for temperature compensation where a temperature compensation element is used as a compensation element for temperature expansion, wherein with temperature change a flat element expands radially and an inclined link device is moved radially whereby the expansion radial from the planar element is converted into an orthogonal motion opposite the planar element. a housing surrounding the planar element depending on the temperature of the temperature compensation element.
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    同族专利:
    公开号 | 公开日
    CN102251944A|2011-11-23|
    CN102251944B|2015-05-06|
    SE534995C2|2012-03-13|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DE10303855A1|2003-01-30|2004-08-19|Dbt Automation Gmbh|Piezoactuator, especially for hydraulic pilot valves, has housing parts of materials with different coefficients of thermal expansion for compensation of thermal length changes of piezo-translator|
    DE10340911B4|2003-09-05|2014-12-04|Robert Bosch Gmbh|Adapter sleeve with temperature compensation|
    EP1603187B1|2004-06-03|2008-04-16|Huber+Suhner Ag|Cavity resonator, use of the cavity resonator in a oscillation circuit|DE102014104398B4|2014-03-28|2016-06-16|Benteler Automobiltechnik Gmbh|Heating device for conductive heating of a sheet metal blank|
    CN109888609B|2019-03-15|2020-04-17|山西大学|Optical cavity with temperature drift self-compensation function|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    SE1050478A|SE534995C2|2010-05-17|2010-05-17|Mechanical temperature compensation element, method of mounting thereof, and method of mechanical temperature compensation|SE1050478A| SE534995C2|2010-05-17|2010-05-17|Mechanical temperature compensation element, method of mounting thereof, and method of mechanical temperature compensation|
    CN201110126023.3A| CN102251944B|2010-05-17|2011-05-16|Mechanical temperature compensation device and means, method for assembling the device|
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    PCT/EP2011/057965| WO2011144610A1|2010-05-17|2011-05-17|Mechanical temperature compensation means, method for assembly said means and method for mechanically temperature compensating|
    EP11719839A| EP2572129A1|2010-05-17|2011-05-17|Piezo electric controlled high-pressure valve and method for controlling a high-pressure valve|
    EP11719837.4A| EP2571555B1|2010-05-17|2011-05-17|Mechanical temperature compensation means, method for assembly said means and method for mechanically temperature compensating|
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